Electroless metal deposition for IC and TSV applications.

James F. Rohan Declan Casey Monika Zygowska Michael Moore Brian Shanahan

Published in: 3DIC (2014)

Keyphrases

thin film
chemical vapor deposition
electron microscopy
grain size
integrated circuit
high density
printed circuit boards
plasma etching
neural network
multi layer
feature vectors
low density
room temperature
artificial neural networks
high temperature
electrical properties
film thickness
data mining