Umamaheswara Rao Tida

Publication Activity (10 Years)

Years Active: 2014-2024
Publications (10 Years): 18

Top Topics

Silicon Dioxide

Top Venues

IEEE Trans. Very Large Scale Integr. Syst.

Publications

Madhava Sarma Vemuri, Umamaheswara Rao Tida
Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC. IEEE Access 12 (2024)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration. CoRR (2023)
Maliha Elma, Madhava Sarma Vemuri, Umamaheswara Rao Tida
Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor for On-Chip Multi-Phase Buck Converter. IEEE Access 11 (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology. ICCD (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration. SOCC (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration. ISQED (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Efficient and Scalable MIV-Transistor with Extended Gate in Monolithic 3D Integration. MWSCAS (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Efficient and Scalable MIV-transistor with Extended Gate in Monolithic 3D Integration. CoRR (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration. CoRR (2023)
Chenyi Wen, Xiao Dong, Baixin Chen, Umamaheswara Rao Tida, Yiyu Shi, Cheng Zhuo
Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter. ACM Trans. Design Autom. Electr. Syst. 27 (5) (2022)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Design and Optimization of Magnetic-core Solenoid Inductor for Multi-phase Buck Converter. MWSCAS (2020)
Dawei Li, Madhava Sarma Vemuri, Umamaheswara Rao Tida
An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits. CoRR (2020)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration. MWSCAS (2020)
Umamaheswara Rao Tida, Cheng Zhuo, Leibo Liu, Yiyu Shi
Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39 (2) (2020)
Umamaheswara Rao Tida, Madhava Sarma Vemuri
Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional Integrated Circuits. SoCC (2020)
Umamaheswara Rao Tida, Cheng Zhuo, Yiyu Shi
Single-Inductor-Multiple-Tier Regulation: TSV-Inductor-Based On-Chip Buck Converters for 3-D IC Power Delivery. IEEE Trans. Very Large Scale Integr. Syst. 27 (10) (2019)
Baixin Chen, Umamaheswara Rao Tida, Cheng Zhuo, Yiyu Shi
Modeling and optimization of magnetic core TSV-inductor for on-chip DC-DC converter. ICCAD (2018)
Umamaheswara Rao Tida, Rongbo Yang, Cheng Zhuo, Yiyu Shi
On the Efficacy of Through-Silicon-Via Inductors. IEEE Trans. Very Large Scale Integr. Syst. 23 (7) (2015)
Umamaheswara Rao Tida, Cheng Zhuo, Yiyu Shi
Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs. ACM J. Emerg. Technol. Comput. Syst. 11 (2) (2014)
Umamaheswara Rao Tida, Cheng Zhuo, Yiyu Shi
Through-silicon-via inductor: Is it real or just a fantasy? ASP-DAC (2014)
Umamaheswara Rao Tida, Varun Mittapalli, Cheng Zhuo, Yiyu Shi
"Green" On-chip Inductors in Three-Dimensional Integrated Circuits. ISVLSI (2014)
Umamaheswara Rao Tida, Varun Mittapalli, Cheng Zhuo, Yiyu Shi
Opportunistic through-silicon-via inductor utilization in LC resonant clocks: concept and algorithms. ICCAD (2014)