Madhava Sarma Vemuri

Publication Activity (10 Years)

Years Active: 2020-2024
Publications (10 Years): 13

Top Topics

Metal Oxide Semiconductor

Efficient Search

Top Venues

Publications

Madhava Sarma Vemuri, Umamaheswara Rao Tida
Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC. IEEE Access 12 (2024)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration. CoRR (2023)
Maliha Elma, Madhava Sarma Vemuri, Umamaheswara Rao Tida
Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor for On-Chip Multi-Phase Buck Converter. IEEE Access 11 (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology. ICCD (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration. SOCC (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration. ISQED (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Efficient and Scalable MIV-Transistor with Extended Gate in Monolithic 3D Integration. MWSCAS (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Efficient and Scalable MIV-transistor with Extended Gate in Monolithic 3D Integration. CoRR (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration. CoRR (2023)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Design and Optimization of Magnetic-core Solenoid Inductor for Multi-phase Buck Converter. MWSCAS (2020)
Dawei Li, Madhava Sarma Vemuri, Umamaheswara Rao Tida
An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits. CoRR (2020)
Madhava Sarma Vemuri, Umamaheswara Rao Tida
Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration. MWSCAS (2020)
Umamaheswara Rao Tida, Madhava Sarma Vemuri
Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional Integrated Circuits. SoCC (2020)