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Single-Inductor-Multiple-Tier Regulation: TSV-Inductor-Based On-Chip Buck Converters for 3-D IC Power Delivery.
Umamaheswara Rao Tida
Cheng Zhuo
Yiyu Shi
Published in:
IEEE Trans. Very Large Scale Integr. Syst. (2019)
Keyphrases
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hilbert curve
high density
computational power
power distribution
power electronics