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Michael Zervas
Publication Activity (10 Years)
Years Active: 2011-2024
Publications (10 Years): 6
Top Topics
Intel Xeon
Waveguide
High Capacity
Noise Shaping
Top Venues
OFC
ECOC
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Publications
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Manuel Kohli
,
Daniel Chelladurai
,
Laurenz Kulmer
,
Killian Keller
,
Yannik Horst
,
Tobias Blatter
,
Joel Winiger
,
David Moor
,
Tatiana Buriakova
,
Michael Zervas
,
Clarissa Convertino
,
Felix Eltes
,
Yuriy Fedoryshyn
,
Ueli Koch
,
Juerg Leuthold
256 GBd Barium-Titanate-on-SiN Mach-Zehnder Modulator.
OFC
(2024)
Junyi Gao
,
Ta Ching Tzu
,
Tasneem Fatema
,
Xiangwen Guo
,
Qianhuan Yu
,
Gabriele Navickaite
,
Michael Zervas
,
Michael Geiselmann
,
Andreas Beling
Heterogeneous balanced photodetector on silicon nitride with 30 GHz bandwidth and 26 dB common mode rejection ratio.
OFC
(2023)
Cosimo Calò
,
Kaoutar Benyahya
,
Haïk Mardoyan
,
Philippe Charbonnier
,
Davide Sacchetto
,
Michael Zervas
,
Karim Mekhazni
,
Delphine Lanteri
,
Harry Gariah
,
Catherine Fortin
,
Nicolas Vaissière
,
Antoine Elias
,
Olivier Parillaud
,
Franck Mallecot
,
Jean Decobert
,
Frédéric Pommereau
,
Jérémie Renaudier
Hybrid InP-SiN microring-resonator based tunable laser with high output power and narrow linewidth for high capacity coherent systems.
OFC
(2022)
Qianhuan Yu
,
Junyi Gao
,
Nan Ye
,
Boheng Chen
,
Keye Sun
,
Linli Xie
,
Kartik Srinivasan
,
Michael Zervas
,
Gabriele Navickaite
,
Michael Geiselmann
,
Andreas Beling
Heterogeneous Photodiodes on Silicon Nitride Waveguides with 20 GHz Bandwidth.
OFC
(2020)
Junqiu Liu
,
Arslan S. Raja
,
Maxim Karpov
,
Bahareh Ghadiani
,
Martin H. P. Pfeiffer
,
Anton Lukashchuk
,
Nils J. Engelsen
,
Hairun Guo
,
Michael Zervas
,
Tobias J. Kippenberg
Ultralow-Power Chip-Based Soliton Microcombs for Photonic Integration.
OFC
(2019)
Junqiu Liu
,
Arslan S. Raja
,
Maxim Karpov
,
Hairun Guo
,
Martin H. P. Pfeiffer
,
Bahareh Ghadiani
,
Michael Zervas
,
Tobias J. Kippenberg
Ultra-Low-Power Photonic Chip-Based Soliton Frequency Combs.
ECOC
(2018)
Yassir Madhour
,
Michael Zervas
,
Gerd Schlottig
,
Thomas Brunschwiler
,
Yusuf Leblebici
,
John Richard Thome
,
Bruno Michel
Integration of intra chip stack fluidic cooling using thin-layer solder bonding.
3DIC
(2013)
Giulia Beanato
,
Paolo Giovannini
,
Alessandro Cevrero
,
Panagiotis Athanasopoulos
,
Michael Zervas
,
Yuksel Temiz
,
Yusuf Leblebici
Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology.
IEEE J. Emerg. Sel. Topics Circuits Syst.
2 (2) (2012)
Hao Su
,
Michael Zervas
,
Gregory A. Cole
,
Cosme Furlong
,
Gregory S. Fischer
Real-time MRI-guided needle placement robot with integrated fiber optic force sensing.
ICRA
(2011)