Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology.
Giulia BeanatoPaolo GiovanniniAlessandro CevreroPanagiotis AthanasopoulosMichael ZervasYuksel TemizYusuf LeblebiciPublished in: IEEE J. Emerg. Sel. Topics Circuits Syst. (2012)