Login / Signup

Integration of intra chip stack fluidic cooling using thin-layer solder bonding.

Yassir MadhourMichael ZervasGerd SchlottigThomas BrunschwilerYusuf LeblebiciJohn Richard ThomeBruno Michel
Published in: 3DIC (2013)
Keyphrases
  • high speed
  • data integration
  • printed circuit boards
  • low cost
  • analog vlsi
  • information systems
  • modular design
  • data sets
  • databases
  • finite element
  • application layer
  • single chip
  • heat transfer