Kyung-Wook Paik

Publication Activity (10 Years)

Years Active: 2006-2022
Publications (10 Years): 2

Top Topics

Business Intelligence

Electron Microscopy

Design Parameters

Top Venues

Microelectron. Reliab.

Publications

Taemin Lee, Joontaek Jung, Sang-Mok Lee, Jongcheol Park, Jae-Hyeong Park, Kyung-Wook Paik, Hyunjoo J. Lee
FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays. Sensors 22 (15) (2022)
Shuye Zhang, Tiesong Lin, Peng He, Kyung-Wook Paik
Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly. Microelectron. Reliab. 78 (2017)
Jiwon Shin, Il Kim, Yong-Won Choi, Young Soon Kim, Un Byung Kang, Young Kun Jee, Kyung-Wook Paik
Non-conductive film with Zn-nanoparticles (Zn-NCF) for 40 μm pitch Cu-pillar/Sn-Ag bump interconnection. Microelectron. Reliab. 55 (2) (2015)
Kyung-Woon Jang, Jin-Hyoung Park, Soon-Bok Lee, Kyung-Wook Paik
A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages. Microelectron. Reliab. 52 (6) (2012)
Kyoung-Lim Suk, Kyosung Choo, Sung Jin Kim, Jong-Soo Kim, Kyung-Wook Paik
Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs). Microelectron. Reliab. 52 (6) (2012)
Chang-Kyu Chung, Jae-Han Kim, Jong-Won Lee, Kyoung-Won Seo, Kyung-Wook Paik
ACFs in fine-pitch chip-on-glass applications. Microelectron. Reliab. 52 (1) (2012)
Kyoung-Lim Suk, Ho-Young Son, Chang-Kyu Chung, Joong Do Kim, Jin-Woo Lee, Kyung-Wook Paik
Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs). Microelectron. Reliab. 52 (1) (2012)
Kyung-Woon Jang, Chang-Kyu Chung, Woong-Sun Lee, Kyung-Wook Paik
Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications. Microelectron. Reliab. 48 (7) (2008)
Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik
Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. Microelectron. Reliab. 46 (2-4) (2006)
Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. Microelectron. Reliab. 46 (2-4) (2006)