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Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs).

Kyoung-Lim SukKyosung ChooSung Jin KimJong-Soo KimKyung-Wook Paik
Published in: Microelectron. Reliab. (2012)
Keyphrases
  • high speed
  • multi layer
  • low cost
  • high temperature
  • lightweight
  • software packages
  • grain size
  • silicon dioxide