Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs).
Kyoung-Lim SukHo-Young SonChang-Kyu ChungJoong Do KimJin-Woo LeeKyung-Wook PaikPublished in: Microelectron. Reliab. (2012)
Keyphrases
- high speed
- cmos technology
- low cost
- cmos image sensor
- analog vlsi
- high density
- single chip
- physical design
- case study
- nm technology
- vlsi implementation
- low power
- modular design
- ibm zenterprise
- software package
- evolvable hardware
- programmable logic
- higher level
- memory subsystem
- computer systems
- real time
- silicon on insulator
- dynamic random access memory