Tiesong Lin

Publication Activity (10 Years)

Years Active: 2017-2017
Publications (10 Years): 1

Top Topics

Printed Circuit Boards

Evolutionary Algorithm

Design Parameters

Top Venues

Microelectron. Reliab.

Publications

Shuye Zhang, Tiesong Lin, Peng He, Kyung-Wook Paik
Effects of acrylic adhesives property and optimized bonding parameters on Sn-58Bi solder joint morphology for flex-on-board assembly. Microelectron. Reliab. 78 (2017)