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Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study.
Woon-Seong Kwon
Suk-Jin Ham
Kyung-Wook Paik
Published in:
Microelectron. Reliab. (2006)
Keyphrases
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electrical properties
printed circuit boards
low cost
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sufficient conditions
infrared
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transmission line
neural network
image registration
software package
simplex method
power grid
vlsi implementation
visible spectrum
programmable logic