Kenneth S. M. Fung

Publication Activity (10 Years)

Years Active: 2006-2015
Publications (10 Years): 0

Top Topics

Matching Algorithm

Top Venues

Image Processing: Machine Vision Applications

IEEE Trans. Instrum. Meas.

Publications

Fuqin Deng, Chang Liu, Wuifung Sze, Jiangwen Deng, Kenneth S. M. Fung, Edmund Y. Lam
An INSPECT Measurement System for Moving Objects. IEEE Trans. Instrum. Meas. 64 (1) (2015)
Fuqin Deng, Jia Chen, Jianyang Liu, Zhijun Zhang, Jiangwen Deng, Kenneth S. M. Fung, Edmund Y. Lam
An edge-from-focus approach to 3D inspection and metrology. Image Processing: Machine Vision Applications (2015)
Fuqin Deng, Zhao Li, Jia Chen, Jiangwen Deng, Kenneth S. M. Fung, Edmund Y. Lam
An elliptic phase-shift algorithm for high speed three-dimensional profilometry. Image Processing: Machine Vision Applications (2013)
Fuqin Deng, Chang Liu, Wuifung Sze, Jiangwen Deng, Kenneth S. M. Fung, Edmund Y. Lam
A polynomial phase-shift algorithm for high precision three-dimensional profilometry. Image Processing: Machine Vision Applications (2013)
Fuqin Deng, Chang Liu, Wuifung Sze, Jiangwen Deng, Kenneth S. M. Fung, W. H. Leung, Edmund Y. Lam
An illumination-invariant phase-shifting algorithm for three-dimensional profilometry. Image Processing: Machine Vision Applications (2012)
Zhaozheng Hu, Ronald Chung, Kenneth S. M. Fung
EC-EGI: enriched complex EGI for 3D shape registration. Mach. Vis. Appl. 21 (2) (2010)
Ada N. Y. Ng, Edmund Y. Lam, Ronald Chung, Kenneth S. M. Fung, W. H. Leung
Reference-Free Machine Vision Inspection of semiconductor die Images. Int. J. Image Graph. 9 (1) (2009)
Jun Cheng, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung
Handling of multi-reflections in wafer bump 3D reconstruction. SMC (2008)
Jun Cheng, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung, Yangsheng Xu
Optimization of Bit-Pairing Codification with Learning for 3D Reconstruction. Int. J. Image Graph. 7 (3) (2007)
Mei Dong, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung
Use of Paraplanar Constraint for Parallel Inspection of Wafer Bump Heights. IPCV (2007)
Shu Yuan, Ronald Chung, Tan Zheng, Jun Cheng, Edmund Y. Lam, Kenneth S. M. Fung, Fan Wang
A novel design of grating projecting system for 3D reconstruction of wafer bumps. Three-Dimensional Image Capture and Applications (2006)
Jun Cheng, Ronald Chung, Edmund Y. Lam, Kenneth S. M. Fung
Bit-pairing Codification for Binary Pattern Projection System. ICPR (2) (2006)