Login / Signup

Handling of multi-reflections in wafer bump 3D reconstruction.

Jun ChengRonald ChungEdmund Y. LamKenneth S. M. Fung
Published in: SMC (2008)
Keyphrases
  • three dimensional
  • neural network
  • computer vision
  • data sets
  • learning algorithm
  • feature selection
  • decision making
  • decision trees
  • data streams
  • structure from motion
  • image pairs
  • semiconductor manufacturing