Jianfeng Li

Publication Activity (10 Years)

Years Active: 2015-2018
Publications (10 Years): 3

Top Topics

Modular Structure

Empirical Studies

Top Venues

Microelectron. Reliab.

Publications

Jianfeng Li, Jingru Dai, Christopher Mark Johnson
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. Microelectron. Reliab. 84 (2018)
Elaheh Arjmand, Pearl A. Agyakwa, Martin R. Corfield, Jianfeng Li, Bassem Mouawad, C. Mark Johnson
A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectron. Reliab. 59 (2016)
Imran Yaqub, Jianfeng Li, Christopher Mark Johnson
Dependence of overcurrent failure modes of IGBT modules on interconnect technologies. Microelectron. Reliab. 55 (12) (2015)