Martin R. Corfield

Publication Activity (10 Years)

Years Active: 2011-2016
Publications (10 Years): 1

Top Topics

High Reliability

Empirical Studies

Software Reliability

Top Venues

Microelectron. Reliab.

Publications

Elaheh Arjmand, Pearl A. Agyakwa, Martin R. Corfield, Jianfeng Li, Bassem Mouawad, C. Mark Johnson
A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectron. Reliab. 59 (2016)
H. Q. S. Dang, Martin R. Corfield, Alberto Castellazzi, C. Mark Johnson, Patrick Wheeler
Repetitive high peak current pulsed discharge film-capacitor reliability testing. Microelectron. Reliab. 52 (9-10) (2012)
Pearl A. Agyakwa, Martin R. Corfield, Li Yang, J. F. Li, V. M. F. Marques, C. Mark Johnson
Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling. Microelectron. Reliab. 51 (2) (2011)