Pearl A. Agyakwa

Publication Activity (10 Years)

Years Active: 2011-2016
Publications (10 Years): 2

Top Topics

Wavelet Transform

Power Electronics

Experimental Design

Top Venues

Microelectron. Reliab.

Publications

Mohd. Amir Eleffendi, Li Yang, Pearl A. Agyakwa, C. Mark Johnson
Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement. Microelectron. Reliab. 59 (2016)
Elaheh Arjmand, Pearl A. Agyakwa, Martin R. Corfield, Jianfeng Li, Bassem Mouawad, C. Mark Johnson
A thermal cycling reliability study of ultrasonically bonded copper wires. Microelectron. Reliab. 59 (2016)
Elaheh Arjmand, Pearl A. Agyakwa, C. Mark Johnson
Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods. Microelectron. Reliab. 54 (9-10) (2014)
R. Skuriat, J. F. Li, Pearl A. Agyakwa, N. Mattey, Paul Evans, C. Mark Johnson
Degradation of thermal interface materials for high-temperature power electronics applications. Microelectron. Reliab. 53 (12) (2013)
Pearl A. Agyakwa, Martin R. Corfield, Li Yang, J. F. Li, V. M. F. Marques, C. Mark Johnson
Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling. Microelectron. Reliab. 51 (2) (2011)
Li Yang, Pearl A. Agyakwa, C. Mark Johnson
A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects. Microelectron. Reliab. 51 (9-11) (2011)