Login / Signup
Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement.
Mohd. Amir Eleffendi
Li Yang
Pearl A. Agyakwa
C. Mark Johnson
Published in:
Microelectron. Reliab. (2016)
Keyphrases
</>
high power
high density
infrared
low cost
low power
wavelet transform
steady state
high speed
computer simulation
shortest path
input output