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Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints.

Jianfeng LiJingru DaiChristopher Mark Johnson
Published in: Microelectron. Reliab. (2018)
Keyphrases
  • artificial intelligence
  • power consumption
  • power management
  • high speed
  • power distribution
  • database
  • case study
  • mobile devices
  • power generation