Jingru Dai

Publication Activity (10 Years)

Years Active: 2018-2018
Publications (10 Years): 1

Top Topics

Power Distribution

Top Venues

Microelectron. Reliab.

Publications

Jianfeng Li, Jingru Dai, Christopher Mark Johnson
Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints. Microelectron. Reliab. 84 (2018)