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Hao Chen
Publication Activity (10 Years)
Years Active: 2012-2020
Publications (10 Years): 8
Top Topics
Analog Vlsi
Hilbert Curve
Deep Learning
Cost Reduction
Top Venues
ITC
ITC-Asia
IEEE Des. Test
VLSI-DAT
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Publications
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Chien-Hui Chuang
,
Kuan-Wei Hou
,
Cheng-Wen Wu
,
Mincent Lee
,
Chia-Heng Tsai
,
Hao Chen
,
Min-Jer Wang
A Deep Learning-Based Screening Method for Improving the Quality and Reliability of Integrated Passive Devices.
ITC-Asia
(2020)
Mincent Lee
,
Cheng-Tse Lu
,
Chia-Heng Tsai
,
Hao Chen
,
Min-Jer Wang
Site-aware Anomaly Detection with Machine Learning for Circuit Probing to Prevent Overkill.
ITC-Asia
(2020)
Chia-Heng Tsai
,
Chi-Chang Lai
,
Hao Chen
,
Min-Jer Wang
Novel Circuit Probing for Tiny Inductor.
ITC-Asia
(2020)
Chien-Hui Chuang
,
Kuan-Wei Hou
,
Cheng-Wen Wu
,
Mincent Lee
,
Chia-Heng Tsai
,
Hao Chen
,
Min-Jer Wang
A Deep Learning-Based Screening Method for Improving the Quality and Reliability of Integrated Passive Devices.
ITC
(2020)
Hao Chen
,
Mincent Lee
,
Liang-Yen Chen
,
Min-Jer Wang
High Quality Test Methodology for Highly Reliable Devices.
ITC
(2019)
Kai-Li Wang
,
Bing-Yang Lin
,
Cheng-Wen Wu
,
Mincent Lee
,
Hao Chen
,
Hung-Chih Lin
,
Ching-Nen Peng
,
Min-Jer Wang
Test Cost Reduction Methodology for InFO Wafer-Level Chip-Scale Package.
IEEE Des. Test
34 (3) (2017)
Hao Chen
,
Hung-Chih Lin
,
Min-Jer Wang
Fan-out wafer level chip scale package testing.
ITC-Asia
(2017)
Yu-Chieh Huang
,
Bing-Yang Lin
,
Cheng-Wen Wu
,
Mincent Lee
,
Hao Chen
,
Hung-Chih Lin
,
Ching-Nen Peng
,
Min-Jer Wang
Efficient probing schemes for fine-pitch pads of InFO wafer-level chip-scale package.
DAC
(2016)
Hao Chen
,
Hung-Chih Lin
,
Ching-Nen Peng
,
Min-Jer Wang
Wafer Level Chip Scale Package copper pillar probing.
ITC
(2014)
Mincent Lee
,
Saman Adham
,
Min-Jer Wang
,
Ching-Nen Peng
,
Hung-Chih Lin
,
Sen-Kuei Hsu
,
Hao Chen
A novel DFT architecture for 3DIC test, diagnosis and repair.
VLSI-DAT
(2014)
Sen-Kuei Hsu
,
Hao Chen
,
Chung-Han Huang
,
Der-Jiann Liu
,
Wei-Hsun Lin
,
Hung-Chih Lin
,
Ching-Nen Peng
,
Min-Jer Wang
Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch.
ITC
(2013)
Tze-Hsin Wu
,
Po-Yuan Chen
,
Mincent Lee
,
Bin-Yen Lin
,
Cheng-Wen Wu
,
Chen-Hung Tien
,
Hung-Chih Lin
,
Hao Chen
,
Ching-Nen Peng
,
Min-Jer Wang
A memory yield improvement scheme combining built-in self-repair and error correction codes.
ITC
(2012)