Test-yield improvement of high-density probing technology using optimized metal backer with plastic patch.
Sen-Kuei HsuHao ChenChung-Han HuangDer-Jiann LiuWei-Hsun LinHung-Chih LinChing-Nen PengMin-Jer WangPublished in: ITC (2013)
Keyphrases
- high density
- field effect transistors
- low density
- close proximity
- data center
- high power
- case study
- thin film
- cost effective
- magnetic recording
- chemical vapor deposition
- high bandwidth
- data processing
- image patches
- rapid development
- cost reduction
- grain size
- personal computer
- power consumption
- steady state
- computer systems
- general purpose
- fuzzy logic
- significant improvement
- information technology
- data mining