Eero Ristolainen

Publication Activity (10 Years)

Years Active: 2001-2006
Publications (10 Years): 0

Publications

Päivi H. Karjalainen, Eero Ristolainen
Balancing temperature dependence of on-wafer SOS inductors. Microelectron. Reliab. 46 (7) (2006)
Laura Frisk, Eero Ristolainen
Flip chip attachment on flexible LCP substrate using an ACF. Microelectron. Reliab. 45 (3-4) (2005)
Laura Frisk, Anne Seppälä, Eero Ristolainen
Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates. Microelectron. Reliab. 44 (9-11) (2004)
Anne Seppälä, Eero Ristolainen
Study of adhesive flip chip bonding process and failure mechanisms of ACA joints. Microelectron. Reliab. 44 (4) (2004)
S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö
The effect of solder paste composition on the reliability of SnAgCu joints. Microelectron. Reliab. 44 (3) (2004)
P. Heino, Eero Ristolainen
Strength of Ta-Si interfaces by molecular dynamics. Microelectron. Reliab. 43 (4) (2003)
P. Heino, Eero Ristolainen
Thermal conduction at the nanoscale in some metals by MD. Microelectron. J. 34 (9) (2003)
S. Myllymaki, Eero Ristolainen, P. Heino, A. Lehto, K. Varjonen
Evaluation Of Resonating Channel Transistor In SOI Wafer. Int. J. Comput. Eng. Sci. 4 (3) (2003)
T. Alander, S. Nurmi, P. Heino, Eero Ristolainen
Impact of component placement in solder joint reliability. Microelectron. Reliab. 42 (3) (2002)
Anne Seppälä, T. Allinniemi, Eero Ristolainen
Failure mechanisms of adhesive flip chip joints. Microelectron. Reliab. 42 (9-11) (2002)
Erja Jokinen, Eero Ristolainen
Anisotropic conductive film flip chip joining using thin chips. Microelectron. Reliab. 42 (12) (2002)
Petteri Palm, Jarmo Määttänen, Aulis Tuominen, Eero Ristolainen
Reliability of 80 mum pitch flip chip attachment on flex. Microelectron. Reliab. 41 (5) (2001)