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Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates.
Laura Frisk
Anne Seppälä
Eero Ristolainen
Published in:
Microelectron. Reliab. (2004)
Keyphrases
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high density
high speed
low cost
modular design
outer sheath
lightweight
thin film
neural network
three dimensional
data center
degrees of freedom
reliability analysis
vlsi implementation