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Anne Seppälä
ORCID
Publication Activity (10 Years)
Years Active: 2002-2004
Publications (10 Years): 0
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Publications
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Laura Frisk
,
Anne Seppälä
,
Eero Ristolainen
Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates.
Microelectron. Reliab.
44 (9-11) (2004)
Anne Seppälä
,
Eero Ristolainen
Study of adhesive flip chip bonding process and failure mechanisms of ACA joints.
Microelectron. Reliab.
44 (4) (2004)
Anne Seppälä
,
T. Allinniemi
,
Eero Ristolainen
Failure mechanisms of adhesive flip chip joints.
Microelectron. Reliab.
42 (9-11) (2002)