Laura Frisk

Publication Activity (10 Years)

Years Active: 2002-2016
Publications (10 Years): 2

Top Topics

Radio Frequency Identification Rfid

High Temperature

Top Venues

Microelectron. Reliab.

IEEE Trans. Reliab.

Publications

Anniina Parviainen, Kati Kokko, Laura Frisk
Corrosion testing of anisotropic conductive adhesive interconnections on FR4, liquid crystal polymer and polyimide substrates. Microelectron. Reliab. 56 (2016)
Sanna Lahokallio, Kirsi Saarinen-Pulli, Laura Frisk
Effects of different test profiles of temperature cycling tests on the reliability of RFID tags. Microelectron. Reliab. 55 (1) (2015)
Elena Mengotti, Liliana I. Duarte, Juha Pippola, Laura Frisk
Fretting corrosion: Analysis of the failure mechanism for low voltage drives applications. Microelectron. Reliab. 54 (9-10) (2014)
Laura Frisk, Kirsi Saarinen-Pulli
Reliability of adhesive joined thinned chips on flexible substrates under humid conditions. Microelectron. Reliab. 54 (9-10) (2014)
Juha Pippola, Tuomas Marttila, Laura Frisk
Protective coatings of electronics under harsh thermal shock. Microelectron. Reliab. 54 (9-10) (2014)
Sanna Lahokallio, Janne Kiilunen, Laura Frisk
High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates. Microelectron. Reliab. 54 (9-10) (2014)
Kirsi Saarinen, Laura Frisk, Leena Ukkonen
Effects of Cycling Humidity on the Performance of RFID Tags With ACA Joints. IEEE Trans. Reliab. 61 (1) (2012)
Kati Kokko, Anniina Parviainen, Laura Frisk
Corrosion protection of anisotropically conductive adhesive joined flip chips. Microelectron. Reliab. 50 (8) (2010)
Johanna Virkki, Tomi Seppälä, Laura Frisk, P. Heino
Accelerated testing for failures of tantalum capacitors. Microelectron. Reliab. 50 (2) (2010)
Johanna Virkki, A. Koskenkorva, Laura Frisk
Development of a matrix test board for capacitor reliability testing. Microelectron. Reliab. 50 (9-11) (2010)
Laura Frisk, Eero Ristolainen
Flip chip attachment on flexible LCP substrate using an ACF. Microelectron. Reliab. 45 (3-4) (2005)
Laura Frisk, Anne Seppälä, Eero Ristolainen
Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates. Microelectron. Reliab. 44 (9-11) (2004)
Laura Frisk, J. Järvinen, R. Ristolainen
Chip on flex attachment with thermoplastic ACF for RFID applications. Microelectron. Reliab. 42 (9-11) (2002)