J. Sundelin

Publication Activity (10 Years)

Years Active: 2004-2004
Publications (10 Years): 0

Publications

S. Nurmi, J. Sundelin, Eero Ristolainen, T. Lepistö
The effect of solder paste composition on the reliability of SnAgCu joints. Microelectron. Reliab. 44 (3) (2004)