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S. Nurmi
Publication Activity (10 Years)
Years Active: 2002-2004
Publications (10 Years): 0
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Publications
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S. Nurmi
,
J. Sundelin
,
Eero Ristolainen
,
T. Lepistö
The effect of solder paste composition on the reliability of SnAgCu joints.
Microelectron. Reliab.
44 (3) (2004)
T. Alander
,
S. Nurmi
,
P. Heino
,
Eero Ristolainen
Impact of component placement in solder joint reliability.
Microelectron. Reliab.
42 (3) (2002)