High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization.
Rolf JohannessenFrøydis OldervollFrode StrislandPublished in: Microelectron. Reliab. (2008)
Keyphrases
- film thickness
- thin film
- high temperature
- high density
- electrical properties
- grain size
- room temperature
- white light interferometry
- short circuit
- multi layer
- diesel engine
- solar cell
- chemical vapor deposition
- plasma etching
- integrated circuit
- neural network
- cost effective
- artificial neural networks
- database systems
- decision making
- learning algorithm