Login / Signup

Thermomechanical reliability of a silver nano-colloid die attach for high temperature applications.

P. QuinteroF. Patrick McCluskeyB. Koene
Published in: Microelectron. Reliab. (2014)
Keyphrases
  • high temperature
  • nano scale
  • reliability assessment
  • data mining
  • failure rate
  • data sets
  • artificial intelligence
  • computer vision
  • input output
  • electron microscopy
  • silicon dioxide