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Thin film joining for high-temperature performance of power semi-conductor devices.
Toshihide Takahashi
Shuichi Komatsu
Hiroshi Nishikawa
Tadashi Takemoto
Published in:
Microelectron. Reliab. (2010)
Keyphrases
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thin film
high temperature
short circuit
high density
grain size
mobile devices
solar cell
multi layer
electron microscopy
power consumption
plasma etching
neural network
chemical vapor deposition
room temperature
diesel engine
lessons learned
high resolution
data mining