Sign in
Compact modelling of Through-Silicon Vias (TSVs) in three-dimensional (3-D) integrated circuits.
Roshan Weerasekera
Matt Grange
Dinesh Pamunuwa
Hannu Tenhunen
Li-Rong Zheng
Published in:
3DIC (2009)
Keyphrases
</>
integrated circuit
three dimensional
metal oxide semiconductor
high speed
multi view
d objects
low cost
range images
steady state
high density
electron beam
hardware description language
image sequences
human body
printed circuit boards
gallium arsenide