Fabrication of Solder Balls via Electromagnetic Jetting.
Zhiwei LuoZhihong LiXiang WangWenwang LiPublished in: NEMS (2018)
Keyphrases
- semiconductor devices
- electron beam
- high density
- integrated circuit
- printed circuit boards
- high temperature
- electromagnetic field
- mechanical properties
- simulation software
- image processing
- image analysis
- failure rate
- computer vision
- medical images
- high frequency
- high speed
- bayesian networks
- feature extraction
- three dimensional
- electrical properties