Sign in

Large-Scale 3D Chips: Challenges and Solutions for Design Automation, Testing, and Trustworthy Integration.

Johann KnechtelOzgur SinanogluIbrahim Abe M. ElfadelJens LienigCliff C. N. Sze
Published in: IPSJ Trans. Syst. LSI Des. Methodol. (2017)
Keyphrases