Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study.
Sandeep Kumar GoelSaman AdhamMin-Jer WangJi-Jan ChenTze-Chiang HuangAshok MehtaFrank LeeVivek ChickermaneBrion L. KellerThomas ValindSubhasish MukherjeeNavdeep SoodJeongho ChoHayden Hyungdong LeeJungi ChoiSangdoo KimPublished in: ITC (2013)