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An investigation into the effects of probing and wire bonding stress on the reliability of BOAC.

K. M. ChenB. C. WuK. H. TangF. Y. ChengN. H. KaoJ. Y. Lai
Published in: Microelectron. Reliab. (2006)
Keyphrases
  • finite element
  • stress response
  • wire bonding
  • real time
  • reliability analysis
  • databases
  • website
  • bayesian networks
  • highly reliable