N. H. Kao

Publication Activity (10 Years)

Years Active: 2006-2006
Publications (10 Years): 0

Publications

K. M. Chen, D. S. Jiang, N. H. Kao, J. Y. Lai
Effects of underfill materials on the reliability of low-K flip-chip packaging. Microelectron. Reliab. 46 (1) (2006)
K. M. Chen, B. C. Wu, K. H. Tang, F. Y. Cheng, N. H. Kao, J. Y. Lai
An investigation into the effects of probing and wire bonding stress on the reliability of BOAC. Microelectron. Reliab. 46 (2-4) (2006)