D. S. Jiang

Publication Activity (10 Years)

Years Active: 2006-2006
Publications (10 Years): 0

Publications

K. M. Chen, D. S. Jiang, N. H. Kao, J. Y. Lai
Effects of underfill materials on the reliability of low-K flip-chip packaging. Microelectron. Reliab. 46 (1) (2006)