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Mirror Surface Finishing of Silicon Wafer Edge Using Ultrasonic Assisted Fixed-Abrasive CMP (UF-CMP).
Yongbo Wu
Weiping Yang
Masakazu Fujimoto
Libo Zhou
Published in:
Int. J. Autom. Technol. (2013)
Keyphrases
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high curvature
edge detection
silicon dioxide
low cost
si sio
high speed
three dimensional
viewpoint
d objects
gradient field
range data
surface reconstruction
surface model
smooth surfaces
intensity variations
space charge