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Efficient thermal-oriented 3D floorplanning and thermal via planning for two-stacked-die integration.
Zhuoyuan Li
Xianlong Hong
Qiang Zhou
Jinian Bian
Hannah Honghua Yang
Vijay Pitchumani
Published in:
ACM Trans. Design Autom. Electr. Syst. (2006)
Keyphrases
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infrared
solder ball connect
decision support
lightweight
thermal images
computationally efficient
heuristic search
motion planning
power plant
planning problems
thermal infrared
high temperature
visible spectrum
finite element analysis
information retrieval
data structure
feature selection