Femtosecond Laser Ablation for Backside Silicon Thinning.

Felix Beaudoin J. López M. Faucon Romain Desplats Philippe Perdu

Published in: Microelectron. Reliab. (2004)

Keyphrases

high density
intraoperative
high speed
preprocessing
low cost
topology preserving
topological properties
radio frequency
laser beam
real time
thinning algorithm
space charge
binary pictures
plasma etching
computer assisted