The Visual Inspection of Solder Balls in Semiconductor Encapsulation.
Conceição N. SilvaNeandra P. FerreiraSharlene S. MeirelesMario OtaniVandermi J. da SilvaCarlos Alberto Oliveira de FreitasFelipe G. OliveiraPublished in: ICINCO (2022)
Keyphrases
- visual inspection
- printed circuit boards
- semiconductor devices
- image analysis
- laser scanning
- information integration
- registration accuracy
- semiconductor manufacturing
- high temperature
- fluorescence microscopy images
- object oriented databases
- electron beam
- mechanical properties
- steady state
- gallium arsenide
- genetic algorithm
- production line
- silicon dioxide
- failure rate
- wafer fabrication