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Twice-etched silicon approach for via-last through-silicon-via with a Parylene-HT liner.

Bui Thanh TungNaoya WatanabeMasahiro AoyagiKatsuya Kikuchi
Published in: 3DIC (2015)
Keyphrases
  • low cost
  • high speed
  • high density
  • hough transform
  • gallium arsenide
  • case study
  • multiscale
  • transmission electron microscopy
  • plasma etching
  • e learning
  • multimedia
  • color images
  • x ray
  • semiconductor devices