Werner Kanert

Publication Activity (10 Years)

Years Active: 2003-2014
Publications (10 Years): 0

Top Topics

Embedded Devices

Simulation Study

Top Venues

Microelectron. Reliab.

Publications

Werner Kanert
Robustness Validation - A physics of failure based approach to qualification. Microelectron. Reliab. 54 (9-10) (2014)
Reinhard Pufall, Michael Goroll, Joachim Mahler, Werner Kanert, M. Bouazza, Olaf Wittler, Rainer Dudek
Degradation of moulding compounds during highly accelerated stress tests - A simple approach to study adhesion by performing button shear tests. Microelectron. Reliab. 52 (7) (2012)
Werner Kanert
Active cycling reliability of power devices: Expectations and limitations. Microelectron. Reliab. 52 (9-10) (2012)
V. Müller, Horst Lewitschnig, N. Kortik, Werner Kanert
Quality assurance in automotive electronics. Elektrotech. Informationstechnik 128 (10) (2011)
Reinhard Pufall, Werner Kanert, Stefano Aresu, Michael Goroll
Reduction of test effort. Looking for more acceleration for reliable components for automotive applications. Microelectron. Reliab. 48 (8-9) (2008)
Stefano Aresu, Werner Kanert, Reinhard Pufall, Michael Goroll
Exceptional operative gate voltage induces negative bias temperature instability (NBTI) on n-type trench DMOS transistors. Microelectron. Reliab. 47 (9-11) (2007)
Michael Goroll, Werner Kanert, Reinhard Pufall, Stefano Aresu
Analysis of ESD protection structure behaviour after ageing as new approach for system level reliability of automotive power devices. Microelectron. Reliab. 47 (9-11) (2007)
Michael Goroll, Werner Kanert, Reinhard Pufall
ESD protection structure qualification - a new approach for release for automotive applications. Microelectron. Reliab. 46 (9-11) (2006)
Michael Goroll, Reinhard Pufall, Werner Kanert, Boris Plikat
Semiconductors in high temperature applications - a future trend in automotive industry. Microelectron. Reliab. 44 (9-11) (2004)
Werner Kanert, H. Dettmer, Boris Plikat, Norbert Seliger
Reliability aspects of semiconductor devices in high temperature applications. Microelectron. Reliab. 43 (9-11) (2003)