Wen-Bin Young

Publication Activity (10 Years)

Years Active: 2003-2018
Publications (10 Years): 1

Top Topics

Numerical Simulations

Top Venues

Comput. Math. Appl.

Microelectron. Reliab.

Publications

Ying-Xuan Chen, Shing-Cheng Chang, Wen-Bin Young
Application of lattice Boltzmann method in free surface flow simulation of micro injection molding. Comput. Math. Appl. 75 (7) (2018)
Xue-Ru Guo, Wen-Bin Young
Vacuum effect on the void formation of the molded underfill process in flip chip packaging. Microelectron. Reliab. 55 (3-4) (2015)
Ching-Ho Chang, Wen-Bin Young
Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA. Microelectron. Reliab. 51 (4) (2011)
Wen-Bin Young
Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation. Microelectron. Reliab. 50 (7) (2010)
Meng-Fu Shih, Wen-Bin Young
Experimental study of filling behaviors in the underfill encapsulation of a flip-chip. Microelectron. Reliab. 49 (12) (2009)
Wen-Bin Young
Anisotropic behavior of the capillary action in flip chip underfill. Microelectron. J. 34 (11) (2003)