Experimental study of filling behaviors in the underfill encapsulation of a flip-chip.

Meng-Fu Shih Wen-Bin Young

Published in: Microelectron. Reliab. (2009)

Keyphrases

experimental study
low cost
high speed
experimental evaluation
analog vlsi
programmable logic
information integration
databases
solid models
single chip
high density
circuit design
behavior analysis
vlsi design
real world
data sets
host computer