Development of a mathematical model for thermal-compression bonding of the COG packaging process using NCA.
Ching-Ho ChangWen-Bin YoungPublished in: Microelectron. Reliab. (2011)
Keyphrases
- mathematical model
- design process
- mathematical models
- ant colony algorithm
- development process
- case study
- high speed
- control strategy
- process model
- data compression
- simulation model
- software engineering
- artificial intelligence
- mathematical modeling
- information processing
- knowledge based systems
- knowledge management
- feasible solution
- reverse engineering
- power plant