Satish Bonam

Publication Activity (10 Years)

Years Active: 2015-2022
Publications (10 Years): 5

Top Topics

Electron Microscopy

Mechanical Properties

Developing Intelligent

Stainless Steel

Top Venues

Publications

Satish Bonam, Jose Joseph, Aditya Bhagavathi, Shiv Govind Singh, Siva Rama Krishna Vanjari
Silk Piezoelectric Tactile Sensors: The Way Forward to Developing Intelligent Implantable Sensors. ISCAS (2022)
Suraj Patil, Asisa Kumar Panigrahi, Satish Bonam, C. Hemanth Kumar, Om Krishan Singh, Shiv Govind Singh
Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration. 3DIC (2016)
Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh
Low temperature CMOS compatible Cu-Cu thermo-compression bonding with constantan alloy passivation for 3D IC integration. 3DIC (2016)
Kumail Khurram, Asisa Kumar Panigrahi, Satish Bonam, Om Krishan Singh, Shiv Govind Singh
Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC. 3DIC (2016)
Asisa Kumar Panigrahi, Satish Bonam, Tamal Ghosh, Siva Rama Krishna Vanjari, Shiv Govind Singh
Long term efficacy of ultra-thin Ti passivation layer for achieving low temperature, low pressure Cu-Cu Wafer-on-Wafer bonding. 3DIC (2015)