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Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC.

Kumail KhurramAsisa Kumar PanigrahiSatish BonamOm Krishan SinghShiv Govind Singh
Published in: 3DIC (2016)
Keyphrases
  • inter layer
  • thermal conductivity
  • heat transfer
  • electrical properties
  • scalable video coding
  • integrated circuit
  • air conditioning
  • single layer
  • base layer
  • inter frame
  • rate distortion
  • fuzzy logic
  • video coding