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Om Krishan Singh
Publication Activity (10 Years)
Years Active: 2016-2016
Publications (10 Years): 4
Top Topics
Inter Layer
Thermal Conductivity
Denoising
Low Signal To Noise Ratio
Top Venues
3DIC
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Publications
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Suraj Singh
,
Asisa Kumar Panigrahi
,
Om Krishan Singh
,
Shiv Govind Singh
Analysis of graphene and CNT based finned TTSV and spreaders for thermal management in 3D IC.
3DIC
(2016)
Suraj Patil
,
Asisa Kumar Panigrahi
,
Satish Bonam
,
C. Hemanth Kumar
,
Om Krishan Singh
,
Shiv Govind Singh
Improved noise coupling performance using optimized Teflon liner with different TSV structures for 3D IC integration.
3DIC
(2016)
Kumail Khurram
,
Asisa Kumar Panigrahi
,
Satish Bonam
,
Om Krishan Singh
,
Shiv Govind Singh
Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC.
3DIC
(2016)
C. Hemanth Kumar
,
Asisa Kumar Panigrahi
,
Om Krishan Singh
,
Shiv Govind Singh
Noise performance improvement through optimized stacked layer of liner structure around the TSV in 3D IC.
3DIC
(2016)